Connectors

Wired or wireless, we are increasingly dependent on microelectronics – desktops, laptops, cell phones, PDAs, game boxes, and CD and DVD players are the most visible face of the microelectronics revolution. The hidden face of microelectronics is in our automobiles (which may have as many as 50 different microprocessors) and in our appliances.

As the number of hardware components increases, more miniaturization and higher speed connections are needed. Shrinking components and accelerating data rates require more complex designs and components with conductors spaced ever more closely. Connector design is driven to thin walls and tight dimensional tolerances while retaining the required electrical characteristics. And that’s not all – new generation lead-free solder compositions are increasing the temperatures that parts must withstand during reflow solder assembly.

Ticona’s high performance resins are up to the challenge. Vectra® liquid crystal polymer (LCP) products are available with excellent flow to fill long thin walls, high mechanical properties to keep contacts where they should be, and high temperature tolerance to pass reflow soldering without distortion. Special grades of Vectra LCP are available for metallization to make 3D molded interconnect devices, or for shielding purposes.

If even higher temperature capability is needed, Ticona offers Fortron® polyphenylene sulfide (PPS) products. These reinforced resins can have heat deflection temperature (HDT) values over 260ºC (500º F) and are also readily moldable in thin-wall sections with long flow paths. Both Fortron PPS and Vectra LCP products are inherently V-0 in the UL-94 flame test.

For more traditional connector designs, Ticona has numerous V-0 grades of Celanex® polybutylene terephthalate (PBT). These tried and tested products are available with various levels of glass reinforcement, or glass and mineral filled or even as unfilled formulations.